Black Sesame Intelligent Technology wins the designated project of the Red Flag Program and will build an automatic driving domain control platform

Black Sesame Intelligent Technology to build automatic driving domain control platform for Red Flag Program

【PhoneAuto News】Recently, Heizhima Intelligent WeChat public account announced that it has obtained the mass production intelligent driving chip for the next-generation FEEA3.0 electronic architecture platform project under FAW Hongqi. It is reported that based on the Heizhima Intelligent Huashan II A1000L series chip, FAW Hongqi will create a non-time-sharing and high-cost-effective automatic driving domain control platform for parking and driving. This platform will be applied to about 80% of FAW Hongqi’s vehicle models. At the same time, the cooperation model E001 and E202 developed by both parties based on the Heizhima Intelligent A1000L chip will be mass-produced by 2024 at the earliest.

According to PhoneAuto, Heizhima Intelligence has formed a comprehensive cooperation with FAW Group, FAW Intelligent Network Connection Development Institute, and FAW Nanjing from front-end technology research and development, basic platform construction to mass production projects. This time, Heizhima Intelligent has helped FAW Hongqi to build an automatic driving domain control platform, further deepening the strategic cooperation relationship between the two parties and accelerating the cooperation and win-win situation between independent brands and local chips.

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Currently, with the rapid penetration of intelligent driving, the automotive industry is stepping into a new stage of intelligence. As the core link of the intelligent automobile industry chain, chips promote the intelligent leap of the automobile industry. The Heizhima Intelligent Huashan II A1000L chip has a calculation power of 16TOPS(INT8) and meets multiple vehicle regulations. It has entered mass production in all aspects. The Drive Sensing solution based on the A1000L chip is the only parking and driving integrated solution that can be mass-produced with a single SoC chip in the industry. It supports L2+ driving navigation NOA, parking HPA/AVP, 3D 360 panoramic view, multi-way DVR and other functions, providing the industry with high-value and cost-advantageous chip solutions with ultimate cost-effectiveness.

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